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Edge Computing | SMI-EIPC-013
Quick Details
OEM：
Refuse
Sample:
Available
Payment:
L/C,T/T,D/P,D/A
Place of Origin：
China
Supply Ability：
5000 piece per month
Quick Details
Shipping fee
Shipping fee
Product Description
It is an embedded edge computing device designed for industrial scenarios，provided 200/275 Tops computing capability. The equipment adopts high efficiency and active heat dissipation design, which can operate stably in harsh industrial environment. The fastening embedded design can achieve high vibration resistance level. The product provides a variety of I/O interface to meet the access requirements of multiple sensors. At the same time, it provides efficient sensor clock synchronization function, and reserves a variety of internal expansion interface to provide more wireless communication and storage expansion solutions.
Product Features
◆High performance active fan cooling system
◆IP5X Protection
◆5*Gigabit Port
◆Vibration resistance according to IEC 60068
◆-20℃-60℃ Operating temperature
◆Various I/O interface and expansion
◆IP5X Protection
◆5*Gigabit Port
◆Vibration resistance according to IEC 60068
◆-20℃-60℃ Operating temperature
◆Various I/O interface and expansion
Specification
| Processor | NVIDIA Jetson AGX Orin 32 GB | NVIDIA Jetson AGX Orin 64 GB | |
| Machine vision performance | 200 TOPS | 275 TOPS | |
| CPU | 8 Core ARM® Cortex®-A78 | 12 Core ARM® Cortex®-A78 | |
| GPU | NVIDIA Ampere 1792-CUDA® Core | NVIDIA Ampere 2048-CUDA® Core | |
| Memory | 32 GB 64 bit LPDDR4 204 GB/s | 64 GB 64 bit LPDDR4 204 GB/s | |
| DL accelerator | 2*NVDLA 2.0 Engines | ||
| Storage | 64GB eMMC 5.1 | ||
| Video encode | AV11*4K30, 3*1080p60, 7*1080p30H.264/H.2651*4K60, 2*4k30, 6*1080p60, 15*1080p30VP91*4K60, 2*4k30, 6*1080p60, 12*1080p30 | ||
| Video decode | AV11*8K30, 2*4K60, 4*4k30, 10*1080p60, 20*1080p30H.2651*8K30, 2*4K60, 6*4k30, 12*1080p60, 26*1080p30H.2641*4K60, 2*4K30, 6*1080p60, 14*1080p30VP926*1080p30 | ||
| Power supply | |||
| Input type | DC | ||
| Input voltage | Wide input 12-48V 24-48V for PoE (Optional) | ||
| Typical consumption | 60 W | ||
| Mechanical | |||
| Dimension (W*H*D) | 226 mm*70 mm*144.5 mm (I/O ports and mounting holes excluded) | ||
| Weight | 2.3 kg | ||
| Environmental | |||
| Operating temperature | -20℃-60℃ | ||
| Storage temperature | -25℃-80℃ | ||
| Storage humidity | 10%-90% non-condensing | ||
| Vibration | 3 Grms, 10Hz-500Hz, 1h/axis | ||
| Protection | IP5X | ||
| ESD | Touch 6KV, Air 8KV | ||
| I/O | |||
| Interface | Quantity | Note | |
| Function KEY | Power button | 1 | |
| Recovery button | 1 | ||
| Network/Camera | Ethernet | 5*Gigabit Port | Optional：4*PoE+, IEEE 802.3 af PoE+ 15.4 W (max) |
| Video output | HDMI | 1*HDMI 2.0 TYPE A | 5V 1A |
| USB | USB | 4*USB 3.0 TYPE A1*USB 2.0 TYPE C | USB 5V, 1AUSB 2.0 Flashing Port |
| I/O | UART | 3*RS2322*RS4851*Debug | DB9 TerminalRS232_3 FOR GPS TimeSynchronize |
| SYNC I/O | 1*SYNC_IN1*PPS_OUT2*SYNC_OUT | ||
| CAN | 2 | Two CAN in One DB9 TerminalWith CAN chip, terminal resistor120 Ω | |
| GPIO | 8*Isolated DI8*Isolated DOOutput Voltage 1*DC5V, 1*DC12V | DI 5-48V DCDO 5-48V DC | |
| User expansion | TF Socket | 1*TF Slot | MicroSD card supported |
| M.2 | 1*M.2 M Key1*M.2 B Key | M.2 M Key 2280 SIZE NVME SSD M.2 B Key For 5 G | |
| Mini PCle | 2 | For WIFI or 4 G expansion | |
| Nano SIM Socket | 4 | For Nano SIM Card | |